Dusseldorf, Germany, March 14, 2023 / PRNewswire / --

With the increasing application scenarios and end needs of power semiconductors, especially in the field of power devices, it is imperative to adopt better methods to achieve temperature control and electrical performance of power chips. Henkel today announced the launch of a chip adhesive whose high thermal conductivity enables reliable operation of power semiconductor packages. With a thermal conductivity of up to 30 W/m-K, Loctite Ablestik 6395T is one of the best non-metallic sintering products on the market, and does not require sintering. The product is the latest addition to Henkel's portfolio of high thermal conductivity solutions, supporting the integration of backside metallized or bare silicon (Si) chips.

Increased operating temperature is a key factor affecting chip performance, so good heat dissipation helps ensure functional execution and long-term reliability. Ramachandran Trichur, head of the global Market for Semiconductor Packaging Materials at Henkel Adhesives Electronics, explains the heat transfer mechanism of the chip and why the choice of materials is important. "For most high-power semiconductor packages, the primary heat dissipation path of the device is through the chip bonding material. Because the material is in direct contact with the chip, its thermal properties - including material thickness, thermal conductivity and thermal resistance - are critical. The Loctite Ablestik 6395T has a volume thermal conductivity of 30 W/m-K, providing excellent thermal conductivity for metallized or bare silicon chips."

Most high-power semiconductor applications, such as those in electric vehicles, industrial automation systems, and 5G infrastructure components, also require good electrical conductivity. The resistance between the chip and the package is too large, which will cause energy loss, increase the heat dissipation burden, and reduce the energy efficiency of the device. As is the case with thermal conductivity, package electrical performance is heavily influenced by the chip bonding layer - especially in power integrated circuits, where chip bonding is one of the most important factors contributing to resistance or RDS (on). The Loctite Ablestik 6395T improves energy efficiency by significantly reducing resistance.

In addition to favorable electrical and thermal conductivity properties, the Loctite Ablestik 6395T offers excellent processability, sustainability and reliability benefits, including:

High reliability: It meets the level 0 temperature cycle standard and the MSL1 reliability standard, and is suitable for chips with a size not exceeding 3.0mm x 3.0mm

Compatible with a variety of chip surface treatment/lead frame combinations

The content of volatile organic compounds (VOC) is low at curing, less than 5%

Longer operating life: allows high density lead frame packages to have longer operating and drying times

Resin free seepage

Trichur concluded, "While electrical and thermal performance is a top priority, a streamlined bill of materials is also important for customers. The Loctite Ablestik 6395T supports metallized or nonmetallic chip integration, provides lead frame flexibility, and is suitable for a variety of chip sizes - all of which require highly reliable materials. Henkel's unique balance of supply simplification, processability, thermal conductivity and electrical performance effectively enhances the company's leadership position in the field of high-thermal chip bonding."