Thermal conduction bonding scheme of joint fin radiator

For high-power cooling scenarios with small area and high heat, joint fin radiators are a common type of radiators. The jointed fin radiator has separate fins that can be rear-mounted to the bottom plate. This processing method will not be limited by the rolling molding process in production, and the aspect ratio of the fin only needs to be considered according to the actual situation.


There are a variety of ways in which the fins are attached to the base. Brazing is a common assembly process, but it puts workers at risk of being exposed to unusually high temperatures. The high thermal conductivity epoxy adhesive is a simple and safe method for fixing fins and baseboards, which can be assembled quickly and flexibly. The good thermal conductivity, ultra-high bond strength and high temperature resistance greatly simplify the production process and shorten the development cycle.


The high thermal conductivity epoxy bonding process is also suitable for heat sink products such as folding fin radiators, Pin-fin pin radiators and extruded aluminum tube radiators.


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