LOCTITE ECCOBOND UF 3800 is a repairable bottom filling material developed specifically for CSP (chip size package)/BGA (ball grid array) chips. This product can quickly cure at medium temperatures, thereby reducing the stress on components during the curing process. At the same time, it can also provide excellent mechanical reinforcement for solder joints.

• Reworkable

• High glass transition temperature

• Room temperature flowability

• Medium temperature rapid curing