Loctite ® ECCOBOND BF 4 adhesive provides encapsulation, protection, and structural bonding for optical components. This material enhances the use of adhesives AA50 and AA50T for active alignment of optical components. The combination of light cured AA50T for active alignment of optical components and BF-4 for backfilling provides highly reliable performance under temperature and humidity changes.
Technical information | |
Storage temperature | -40.0 °C |
shear strength | 24.0 kg-f |
Curing time@ 100.0 °C | 30.0 minutes |
Application | Chip soldering |
Glass transition temperature (Tg) | 94.0 °C |
Viscosity, Bolefi CP51@ 25.0 °C Speed 5 rpm | 23500.0 mPa.s (cP) |
Number of components | Single component |
Color | black |