LOCTITE ECCOBOND BF 4

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Description:LOCTITE ECCOBOND BF 4、 Epoxy resin, chip bonding

Hot Line:021-68753051 /

Loctite ®  ECCOBOND BF 4 adhesive provides encapsulation, protection, and structural bonding for optical components. This material enhances the use of adhesives AA50 and AA50T for active alignment of optical components. The combination of light cured AA50T for active alignment of optical components and BF-4 for backfilling provides highly reliable performance under temperature and humidity changes.

Technical information
Storage temperature-40.0 °C
shear strength 24.0 kg-f
Curing time@ 100.0 °C30.0 minutes
ApplicationChip soldering
Glass transition temperature (Tg)94.0 °C
Viscosity, Bolefi CP51@ 25.0 °C Speed 5 rpm23500.0 mPa.s (cP)
Number of componentsSingle component
Colorblack