LOCTITE ABLESTIK 84-1LMISR4

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Description：LOCTITE ABLESTIK 84-1LMISR4（known as Ablebond 84-1LMISR4）， Epoxy resin, chip mounting

Hot Line：021-68753051 /

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Product Details

LOCTITE ABLESTIK 84-1LMISR4 (known as Ablebund 84-1LMISR4) conductive chip bonding adhesive is specially developed for high-yield, automated chip bonding equipment. The rheological properties of LOCTITE ABLESPIK 84-1LMISR4 adhesive minimize the dispensing and mounting time of the adhesive without causing tailing or drawing problems. The unique combination of adhesive properties makes this material one of the most widely used chip bonding materials in the semiconductor industry.

electric conduction

Box oven curing

Excellent adhesive properties, minimizing trailing and drawing phenomena

Technical information
CTE Below Tg	40 ppm/°C
CTE, Above Tg	150ppm/°C
Main characteristics	Conductivity: Thermal conductivity, Conductivity: Conductive, Easy to apply Adhesive properties: Excellent, Easy to apply Adhesive properties: Good, Filler: Silver, Strength: High strength, no freezing when placed in low temperature environments, Usability: Easy to use, Modulus: High, Glue dispensing, Thermal stability: Excellent thermal stability, Production efficiency: Ultra high, Adhesive strength: Extremely strong
Volume resistivity	≤ 0.0002 Ohm cm
Extractable ion content, chloride (CI -)	20 ppm
Extractable ion content, sodium (Na+)	10 ppm
Extractable ion content, potassium (K+)	10 ppm
Hygroscopicity, 168 hr. @ 85°C/85% RH	0.6 %
Curing method	heating
Curing time@ 175.0 °C	1 hour
base material	Lead frame: gold, lead frame: silver
Appearance and Form	Paste like substance
Thermal conductivity	2.5 W/mK
application	Chip soldering
Application method	Dosing device
Tensile modulus@ 250 °C	300 N/mm² (44000 psi )
Glass transition temperature (Tg)	120 °C
Viscosity, Bolefi CP51@ 25 °C Speed 5 rpm	8000 mPa.s (cP)
Number of components	Single component
Thixotropic index	five point six
colour	silver

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